Daim ntawv thov ntawm Aluminium Nitride Substrate
Vim nws cov thermal conductivity thiab zoo hluav taws xob rwb thaiv tsev, AlN tau siv nyob rau hauv microelectronic industries.
Surface oxidization tshwm sim nyob rau hauv cov huab cua txawm nyob rau hauv chav tsev kub, txawm li cas los xij, txheej txheej aluminium oxide tuaj yeem tiv thaiv cov khoom mus txog 1370 C. Metallization txoj kev muaj peev xwm tso cai rau txhuas nitride siv hauv cov ntawv siv hluav taws xob zoo ib yam li cov alumina thiab beryllium oxide.
Lub hardness ntawm aluminium nitride ceramic yog ntau dua li alumina, cov tsoos technical ceramics, ua rau nws yog ib qho khoom siv zoo tshaj plaws rau kev siv uas yuav tsum tau hnav tsis kam.
Qhov zoo ntawm AlN Ceramic
* Very high thermal conductivity (>170 W / mK)
* High electrical insulation capacity (>1.1012Ω cm)
* Strength according to the double ring method >320 MPa (biaxial zog)
* Tsawg thermal expansion 4 txog 6x10-6K-1(ntawm 20 thiab 1000 degree)
* Zoo metallization muaj peev xwm
